ECE Seminar Speaker: Dr. Wei Guo, Associate Professor, Department of Physics and Applied Physics, University of Massachusetts Lowell
Topic: “Photonic–Electronic Packaging for Silicon Photonics and Flexible Electronic Systems”
Speaker: Dr. Wei Guo, Associate Professor, Department of Physics and Applied Physics, University of Massachusetts Lowell
Abstract: The rapid evolution of silicon photonics and chiplet-based electronic systems is driving new demands on packaging architectures that tightly integrate optical, electrical, thermal, and mechanical functionality. As device performance scales to higher bandwidths and greater integration densities, packaging has emerged as a primary bottleneck—and opportunity—for system-level innovation.
This talk presents recent work on photonic and electronic packaging strategies for silicon photonics chipsets and heterogeneous integration platforms. Topics include co-packaged optics, III–V gain integration, fiber attach and alignment tolerance engineering, and scalable interconnect architectures for high-speed optical systems.
Beyond rigid substrates, the presentation will also discuss emerging work in electronic textiles (e-textiles) developed in collaboration with U.S. Army partners. These efforts explore flexible, conformal sensor integration and distributed electronics embedded within textile platforms to enable real-time monitoring of biomechanics and human performance in operational environments.
Biography: Dr. Wei Guo received his B.S. degree from Peking University and his Ph.D. from Brown University. He is currently a faculty member in the Department of Physics at the University of Massachusetts Lowell, where he leads research at the intersection of integrated photonics, heterogeneous integration, and advanced electronic–photonic packaging.
His work focuses on bridging materials physics, device engineering, and scalable system integration for emerging applications in silicon photonics, RF systems, and defense technologies. Dr. Guo’s research includes silicon photonics, III–V heterogeneous integration, co-packaged photonic–electronic architectures, and advanced packaging strategies for high-speed optical chipsets. In parallel, his group is developing flexible and textile-integrated sensing platforms in collaboration with U.S. Army partners, advancing electronic textiles (e-textiles) for soldier monitoring, mobility assessment, and human performance optimization.
The Seminars is open to the public free of charge.
*For further information, please contact Dr. Yifei Li
Lester W. Cory Conference Room, Science & Engineering Building (SENG), Room 213A
Yifei Li
5089998841
yifei.li@umassd.edu